Wafer level image sensor package

ABSTRACT

A method for forming an image sensor package is provided. An image sensor chip is formed over a package substrate. A protection layer is formed overlying the image sensor chip. The protection layer has a planar top surface and a bottom surface lining and contacting structures under the protection layer. An opening is formed into the protection layer and spaced around a periphery of the image sensor chip. A light shielding material is filled in the opening to form an on-wafer shield structure having a sidewall directly contact the protection layer.

REFERENCE TO RELATED APPLICATIONS

This Application is a Divisional of U.S. application Ser. No.16/227,138, filed on Dec. 20, 2018, which claims the benefit of U.S.Provisional Application No. 62/736,679, filed on Sep. 26, 2018. Thecontents of the above-referenced Patent Applications are herebyincorporated by reference in their entirety.

BACKGROUND

Digital cameras and optical imaging devices employ image sensors. Imagesensors convert optical images to digital data that may be representedas digital images. An image sensor includes an array of pixel sensorsand supporting logic. The pixel sensors of the array are unit devicesfor measuring incident light, and the supporting logic facilitatesreadout of the measurements. Image sensors often manifest ascharge-coupled devices (CCDs), complementary metal oxide semiconductor(CMOS) devices, or back side illuminated (BSI) devices.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It isnoted that, in accordance with the standard practice in the industry,various features are not drawn to scale. In fact, the dimensions of thevarious features may be arbitrarily increased or reduced for clarity ofdiscussion.

FIG. 1 illustrates a cross-sectional view of some embodiments of animage sensor package having an image sensor chip.

FIG. 2 illustrates a cross-sectional view of some embodiments of animage sensor chip according to FIG. 1.

FIG. 3 illustrates a cross-sectional view of alternative embodiments ofan image sensor package having an image sensor chip.

FIG. 4 illustrates a cross-sectional view of alternative embodiments ofan image sensor package having an image sensor chip.

FIGS. 5-17 illustrate a series of cross-sectional and top views of someembodiments of image sensor chip at various stages of manufacture.

FIG. 18 illustrates a flow chart of some embodiments of a method formanufacturing an image sensor package having an image sensor chip.

DETAILED DESCRIPTION

The present disclosure provides many different embodiments, or examples,for implementing different features of this disclosure. Specificexamples of components and arrangements are described below to simplifythe present disclosure. These are, of course, merely examples and arenot intended to be limiting. For example, the formation of a firstfeature over or on a second feature in the description that follows mayinclude embodiments in which the first and second features are formed indirect contact, and may also include embodiments in which additionalfeatures may be formed between the first and second features, such thatthe first and second features may not be in direct contact. In addition,the present disclosure may repeat reference numerals and/or letters inthe various examples. This repetition is for the purpose of simplicityand clarity and does not in itself dictate a relationship between thevarious embodiments and/or configurations discussed.

Further, spatially relative terms, such as “beneath,” “below,” “lower,”“above,” “upper” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. The spatiallyrelative terms are intended to encompass different orientations of thedevice in use or operation in addition to the orientation depicted inthe figures. The apparatus may be otherwise oriented (rotated 90 degreesor at other orientations) and the spatially relative descriptors usedherein may likewise be interpreted accordingly.

Moreover, “first”, “second”, “third”, etc. may be used herein for easeof description to distinguish between different elements of a figure ora series of figures. “first”, “second”, “third”, etc. are not intendedto be descriptive of the corresponding element. Therefore, “a firstdielectric layer” described in connection with a first figure may notnecessarily corresponding to a “first dielectric layer” described inconnection with another figure.

Image sensors are typically manufactured in bulk on bulk substrates orwafers. The dies to which the image sensors correspond are thenseparated or singulated to form chips, which are typically packaged foruse. Packaging provides protection against impact and corrosion,contacts to connect image sensor chips to external devices, and heatdissipation. Packaging includes bonding an image sensor chip over apackage substrate and electrically coupling the image sensor chip to thepackage substrate. Further, a housing structure is formed over the imagesensor chip to encapsulate the image sensor chip with the packagesubstrate. The completed package can then be bonded and/or electricallycoupled to a flexible printed circuit (FPC) and/or to an externaldevice.

Some optical components are inserted between the housing structure andthe image sensor chip during the packaging process to get good qualityimage. Those optical components may include a set of module lens forradiation guidance and imaging, an infrared cut off filter to filterinfrared light, and a cover glass for dust protection. Also, a lightshield is arranged along sidewalls of the packaged image sensor chip toblock unwanted light. However, the utilization of these opticalcomponents results in high cost and lager package size, which isunfavorable for applications like mobile and medical use.

In view of the foregoing, the present disclosure is directed to a newimage sensor package and improved method for packaging image sensorchips. The improved method forms on-wafer protection layer(s) andoptical components at the wafer level prior to separating the wafer orthe bulk substrates to discrete dies. The improved method may also formopenings between the dies and fill the opening with light shieldmaterial at the wafer level to form on-wafer light shield structuresalong sidewalls of the image sensor chips. By replacing variesprotection and optical components of the individual image sensorpackages with corresponding on-wafer components, those on-waferprotection and optical components are formed directly on the imagesensor chips at the wafer level. Thus, the manufacturing process issimplified, the size and height of the package are reduced, and theperformance of the image sensor is improved.

With reference to FIG. 1, a cross-sectional view 100 of an image sensorpackage according to some embodiments is provided. The image sensorpackage includes an image sensor chip 102 disposed on a packagesubstrate 106. In some embodiments, the package substrate 106 is a bulksemiconductor substrate or a silicon-on-insulator (SOI) substrate. Inother embodiments, the package substrate 106 is another chip orintegrated circuit. In some embodiments, the image sensor chip 102 isone of a charge-coupled device (CCD), a complementary metal oxidesemiconductor (CMOS) device, or a BSI device. In other embodiments, theimage sensor chip 102 can be replaced with another type of chip. Othertypes of chips include memory chips (e.g., flash memory chips), radiofrequency (RF) chips, and so on.

An on-wafer shield structure 104 is spaced around the periphery of theimage sensor chip 102 on the package substrate 106 and along thesidewalls of the image sensor chip 102. A protection layer 110 isarranged to cover the image sensor chip 102. The protection layer 110may have a sidewall directly contacts a sidewall of the on-wafer shieldstructure 104. The protection layer 110 may have a planar top surfacesaligned with that of the on-wafer shield structure 104. The protectionlayer 110 may have a bottom surface lining and contacting structuresunder the protection layer 110. The protection layer 110 may comprisephotoresist, float glass, fused silica, silicon, germanium, acrylicresin or other applicable materials.

In some embodiments, an on-wafer lens 108 is arranged above the imagesensor chip 102 and under the protection layer 110. In some embodiments,the on-wafer lens 108 may extend laterally to the on-wafer shieldstructure 104. In some alternative embodiments, the on-wafer lens 108may have top and sidewall surfaces covered by the protection layer 110.The on-wafer shield structure 104 may directly attach to the on-waferlens 108. Though the on-wafer lens 108 is shown as a single convex lensin the figure, it is appreciated that the on-wafer lens 108 can includemultiple lens and can have other shapes.

In some embodiments, an on-wafer filtering coating 130 is arranged abovethe image sensor chip 102 and under the protection layer 110. Theon-wafer filtering coating 130 may be arranged above or under theon-wafer lens 108. The on-wafer filtering coating 130 is configured tofilter a certain range of radiance spectrum. As an example, the on-waferfiltering coating 130 may be an infrared cut off filter that aredesigned to reflect or block mid-infrared wavelengths while passingvisible light. The on-wafer filtering coatings 130 or the on-wafer lens108 may be photoresist, float glass, fused silica, silicon, germanium,acrylic resin, pigments or other applicable materials.

In some embodiments, a housing structure encloses the protection layer110 and other on-wafer structures above the image sensor chip 102. As anexample, a first housing structure 112 is arranged on the on-wafershield structure 104. The first housing structure 112 extends laterallyinward over the image sensor chip 102, to define a first aperture 114,typically circular in shape, over the image sensor chip 102 between thesidewall of the lateral extension. A second housing structure 122 isarranged, typically removably arranged, in the first aperture 114. Thesecond housing structure 122 includes a second aperture 126, typicallycircular in shape, over the image sensor chip 102. Within the secondaperture 126, a module lens 128 including one or more lenses arearranged. The module lens 128 is designed to focus light on to the imagesensor chip 102 and is secured to the second housing structure 122.

Though not shown in the figure, a bonding structure may be arrangedbetween image sensor chip 102 and the package substrate 106 to bondand/or electrically couple the image sensor chip 102 to the packagesubstrate 106, and/or to electrically couple the image sensor chip 102or the package substrate 106 to an external device and/or external bondpads (not shown). The bonding structure can be a solder ball, but othertypes of bonding structures are amenable.

The height of the image sensor package can be reduced since a discretecover glass or an infrared filter and corresponding interveningmaterials are no longer needed since being replaced by the build inprotection layer 110 and/or the on-wafer filtering coating 130. One ormore lenses of a module lens for the image sensor package can also beomitted or reduced since the on-wafer lens 108 may be installed.Further, the size of the image sensor package can be reduced since adiscrete light shield and corresponding intervening materials are nolonger needed since being replaced by the build in on wafer light shieldstructure 104. For example, the size and the height of the image sensorpackage can be reduced to chip-scale (i.e., no larger than 1.2 times thesize of the chip). Even more, assembly of the image sensor package canbe simplified since minimal changes are needed to the layout of theimage sensor chip.

With reference to FIG. 2, a cross-sectional 200 of an image sensor chipaccording to some embodiments is provided. The image sensor chip issuitable for use as the image sensor chip 102 of FIG. 1. The imagesensor chip includes an integrated circuit (IC) region 202 having an ICcircuit for image sensing and an edge region 204 surrounding the ICregion 202 for external connection to a package substrate and/orexternal device. As some examples, the image sensor chip can be a CCDdevice, a CMOS device, or a BSI device.

A first substrate 206 supports a pixel sensor array 208, such as activepixel sensors, and a supporting logic circuit 210 (collectively the ICcircuit) within the IC region 202. The first substrate 206 is, forexample, a bulk substrate of silicon, germanium, or group III and groupV elements. Alternatively, the first substrate 206 is, for example, aSOI substrate. The pixel sensors are unit devices for the conversion ofan optical image into digital data and correspond to the smallest areasto which light incident on the pixel sensor array 208 can be localizedtherein. The supporting logic circuit 210 supports readout of the pixelsensor array 208. The supporting logic circuit 210 may be arrangedaround the periphery of the pixel sensor array 208.

A device layer 212 and a metallization stack 214 are arranged overand/or with the first substrate 206 to collectively form the pixelsensor array 208 and the supporting logic circuit 210. The device layer212 includes electronic devices, such as transistors, resistors,capacitors, photodiodes, etc., of the image sensor chip. The devicelayer 212 typically includes photodetectors, such as photodiodes, forthe pixel sensor array 208 and transistors for the supporting logiccircuit 210. The metallization stack 214 interconnects the electronicdevices by one or more metallization layers 216 arranged within aninterlayer dielectric (ILD) layer 218. One or more contacts 220electrically couple the device layer 212 to the metallization layers216, and one or more vias 222 electrically couple the metallizationlayers 216 to each other.

In some embodiments, as illustrated, the device layer 212 is arrangedover the metallization stack 214 on a bottom surface of and/or within asecond substrate 224. In other embodiments, the second substrate 224 isomitted and the device layer 212 is arranged below the metallizationstack 214 on a top surface of and/or within the first substrate 206. Thesecond substrate 224 may be employed where the image sensor chip is aBSI device, such that the first substrate 206 serves as a carriersubstrate and the second substrate 224 serves as an image sensorsubstrate. The second substrate 224 is, for example, a bulk substrate ofsilicon, germanium, or group III and group V elements. Alternatively,the second substrate 224 is, for example, a SOI substrate.

In some embodiments, a color filter array 234 may be arranged over thepixel sensor array 208 and a micro lens array 236 is arranged over thecolor filter array 234. The color filter array 234 is a mosaic of tinycolor filters placed to assign colors to the pixel sensors, becausepixel sensors are unable to distinguish between light of differentcolors. For example, the color filter array 234 is a Bayer filter. ABayer filter includes a mosaic of red, green and blue filters arrangedin a filter pattern of 50% green, 25% red, and 25% blue. Such anarrangement of filters is advantageous because red, green, and blue canbe mixed in different combinations to produce most of the colors visibleto the human eye. The micro lens array 236 focuses light through a colorfilter array 234 to the pixel sensor array 208. In some alternativeembodiments, a color filter array is absent, and the micro lens array236 overlies the pixel sensor array 208 and focuses light to the pixelsensor array 208.

In some embodiments, a flatness layer 238 may be arranged between thecolor filter array 234 and the micro lens array 236. The flatness layer238 may be arranged over a top surface of the second substrate 224and/or the metallization stack 214. The flatness layer 238 smooths thetop surface of the color filter array 234 to reduce surface roughness ofthe color filter array 234 and to reduce topographical differencesbetween micro lenses of the micro lens array 236. The flatness layer 238is transparent and includes, for example, silicon oxide or aluminumoxide.

Image sensor bond pads 226 are arranged within the ILD layer 218 and theedge region 204 along sidewalls of the image sensor chip. The imagesensor bond pads 226 are electrically coupled to the IC region 202through the metallization stack 214. The image sensor bond pads 226include one or more external bond pads to electrically couple the devicelayer 212 to external devices for normal use and one or more testingbond pads for wafer acceptance testing (WAT) or circuit probing.

Similar as discussed in FIG. 1 above, the on-wafer shield structure 104is arranged around the periphery of the image sensor chip to definesidewalls of the image sensor chip. The on-wafer shield structure 104may comprise a narrower lower portion and a wider upper portion. Thenarrower lower portion lines the first substrate 206, the metallizationstack 214, the second substrate 224/the device layer 212, and optionallythe flatness layer 238. The wider upper portion lines the on-waferfiltering coating 130, the on-wafer lens 108, and the protection layer110. The on-wafer shield structure 104 and the protection layer 110 mayhave aligned planar top surfaces.

With reference to FIG. 3, a cross-sectional view 300 of an image sensorpackage is provided according to alternative embodiments. The imagesensor package includes an image sensor chip 302 with a filter plate304, such as a glass plate, arranged along the top of the image sensorchip 302 to define a cavity 306 within the image sensor chip 302. Thecavity is suitably arranged over a sensing region of the image sensorchip 302. In some embodiments, the image sensor chip 302 is one of aCCD, a CMOS device, or a BSI device. A passivation layer 308 of theimage sensor chip 302 is arranged along a bottom of the image sensorchip 302. The passivation layer 308 lines TSV holes in the bottom of theimage sensor chip 302. A conductive layer is filled in the TSV anddefines a through substrate via (TSV) 310. A bonding and/or electricalcoupling (B/EC) structure 312 is arranged at the bottom of the imagesensor chip 302 coupling to the TSV 310 to bond and/or electricallycouple the image sensor chip 302 to the external device and/or substratethrough the TSV 310. The B/EC structure 312 is typically solder balls,but other types of bonding structures are amenable.

Similar as described in FIG. 1 and FIG. 2, the first housing structure112 is arranged on and around the periphery of the image sensor chip302. The first housing structure 112 extends vertically above the imagesensor chip 302 and laterally inward over the image sensor chip 302, todefine a first aperture 114. The second housing structure 122 isarranged, typically removably arranged, in the first aperture 114. Amodule lens 128 including one or more lenses is arranged within thesecond housing structure 122. The module lens 128 is designed to focuslight on to the image sensor chip 302. By having the on-wafer shieldstructure 104 replacing a die level light shield around the periphery ofthe image sensor chip 302, the lateral size of the image sensor packageis advantage reduced. By having the protection layer 110 directly on theimage sensor chip 302, a cover glass is omitted, and the height of theimage sensor package is advantage reduced. By having one or moreon-wafer lens 108 directly on the image sensor chip 302, the module lens128 is reduced or omitted, and the imaging quality is improved.

With reference to FIG. 4, a cross-sectional view 400 of an image sensorpackage is provided according to alternative embodiments of FIGS. 1-3.By having the protection layer 110 directly on the image sensor chip302, a cover glass is omitted, and the height of the image sensorpackage is advantage reduced. By having the on-wafer shield structure104 replacing a die level light shield around the periphery of the imagesensor chip, the lateral size of the image sensor package is advantagereduced.

FIGS. 5-17 illustrate a series of cross-sectional views and top views ofan integrated circuit device at various stages of manufacture accordingto some embodiments.

As shown in a cross-sectional view 500 of FIG. 5, a semiconductorstructure having a plurality of image sensor dies including a firstimage sensor die 1002 and a second image sensor die 1004 is provided.The first and second image sensor dies 1002, 1004 correspond tonon-overlapping regions of the semiconductor structure, and are spacedwith a scribe line region 1006 arranged between the first and secondimage sensor dies 1002, 1004. The first and second image sensor dies1002, 1004 include corresponding ICs 1008, 1010 for sensing and/ormeasuring light incident on the first and second image sensor dies 1002,1004. The ICs 1008, 1010 correspond to, for example, CCD devices, CMOSdevices, or BSI devices.

Arranged over and/or within a first substrate 1012, a device layer 1014and a metallization stack 1016 collectively form the ICs 1008, 1010. Thefirst substrate 1012 is, for example, a bulk semiconductor substrate ofsilicon, germanium, or group III and group V elements. Alternatively,the first substrate 1012 is, for example, a SOI substrate. The devicelayer 1014 includes electronic devices, such as transistors, resistors,capacitors, photodiodes, etc. The metallization stack 1016 interconnectsthe electronic devices by one or more metallization layers 1018 arrangedwithin an interlayer ILD layer 1020. One or more contacts 1022electrically couple the device layer 1014 to the metallization layers1018, and one or more vias 1024 electrically couple the metallizationlayers 1018 to each other.

In some embodiments, the device layer 1014 is arranged over themetallization stack 1016 on a bottom surface of and/or within a secondsubstrate 1026. In other embodiments, the second substrate 1026 isomitted and the device layer 1014 is arranged below the metallizationstack 1016 on a top surface of and/or within the first substrate 1012.The second substrate 1026 is, for example, a bulk semiconductorsubstrate of silicon, germanium, or group III and group V elements.Alternatively, the second substrate 1026 is, for example, a SOIsubstrate.

Image sensor bond pads 1028 are arranged within the ILD layer 1020between the first and second image sensor dies 1002, 1004. The imagesensor bond pads 1028 are electrically coupled to the device layer 1014through the metallization stack 1016 to facilitate external connectionof the first and second image sensor dies 1002, 1004 to externaldevices. The first and second image sensor dies 1002, 1004 includecorresponding, non-overlapping regions of the image sensor bonds pads1028 separated by the scribe line region 1006.

As shown in a cross-sectional view 600 of FIG. 6 and a top view 700 ofFIG. 7, a plurality of color filter arrays 1302 corresponding to theplurality of image sensor dies are formed or otherwise arranged oversensing regions of the corresponding image sensor dies. In someembodiments, the color filter arrays 1302 are formed or otherwisearranged on the remaining second substrate 1026. In other embodiments,the color filter arrays 1302 are formed or otherwise arranged on theremaining metallization stack 1016 or the remaining ILD layer 1020. Thecolor filter arrays 1302 are, for example, Bayer filters.

Also shown by FIG. 6, a flatness layer 1304 is formed over the colorfilter arrays 1302 and lining the second substrate 1026. The flatnesslayer 1304 smooths the top surfaces of the color filter arrays 1302 toreduce surface roughness of the color filter arrays 1302 and may betransparent. In some embodiments, the flatness layer 1304 is orotherwise includes, for example, silicon oxide or aluminum oxide, andmay be deposited by way of a vapor deposition technique (e.g., CVD,PE-CVD, PVD, etc.).

Also shown by FIG. 6, a plurality of micro lens arrays 1306corresponding to the color filter arrays 1302 are formed or otherwisearranged over the color filter arrays 1302 and the flatness layer 1304.The micro lens arrays 1306 focus light through the flatness layer 1304and the color filter arrays 1302 to the device layer 1014 for sensing bythe ICs 1008, 1010.

As shown in a cross-sectional view 800 of FIG. 8 and a top view 900 ofFIG. 9, a plurality of on-wafer filtering coatings 130 and/or aplurality of on-wafer lens 108 are optionally formed or otherwisearranged over the color filter arrays 1302 and the micro lens arrays1306. In some embodiments, the on-wafer filtering coatings 130 may bediscrete from one another overlying the micro lens arrays 1306 as shownin FIG. 8. In some alternative embodiments, the on-wafer filteringcoatings 130 may be portions of a first continuous physical layer anddisposed on the micro lens arrays 1306. The first continuous physicallayer lines the flatness layer 1304 between the color filter arrays1302. In some embodiments, the on-wafer lens 108 may be discrete fromone another and disposed on the on-wafer filtering coatings 130 as shownin FIG. 8. In some alternative embodiments, the on-wafer lens 108 may beconvex portions of a second continuous physical layer disposed on theon-wafer filtering coatings 130 or the first continuous physical layer.Depending on applications, the on-wafer lens 108 may also be concave orplanar shapes or other shapes that guide the incident light properly toreach on the color filter arrays 1302. The on-wafer lens 108 can also beabsent. The on-wafer filtering coatings 130 or the on-wafer lens 108 maybe photoresist, float glass, fused silica, silicon, germanium, or otherapplicable materials. The on-wafer filtering coatings 130 or theon-wafer lens 108 may be formed by molding or other patterningprocesses. In some embodiments, the on-wafer lens 108 is about 50 to 200times thicker than the on-wafer filtering coatings 130. For example, theon-wafer filtering coatings 130 may have a thickness of about 1-2 μm,and the on-wafer lens 108 may have a thickness of about 100-200 μm.

As shown in a cross-sectional view 1000 of FIG. 10 and a top view 1100of FIG. 11, a protection layer 110 is formed or otherwise arranged overthe color filter arrays 1302 and the micro lens arrays 1306. In someembodiments, the protection layer 110 is formed all cross the wafer witha planar top surface. The protection layer 110 may be photoresist, floatglass, fused silica, silicon, germanium, acrylic resin, or otherapplicable materials. The protection layer 110 may be formed by spincoating or deposition processes, for example, by a low temperaturechemical-mechanical deposition process. In some embodiments, theprotection layer 110 has a thickness greater than the on-wafer lens 108from a top surface of the on-wafer lens 108 to the top surface of theprotection layer 110. For example, the protection layer 110 may have athickness of about 300 μm.

As shown in a cross-sectional view 1200 of FIG. 12 and a top view 1300of FIG. 13, an opening 1102 is formed between the first and second imagesensor die 1002, 1004. In some embodiments, a first etch is performedthrough select regions of the protection layer 110, the flatness layer1304, the second substrate 1026, the metallization stack 1016, and/orthe ILD layer 1020 to reach on the first substrate 1012 and form theopening 1102. The process for the first etch includes, for example,forming a first photoresist layer over a top surface of the protectionlayer 110, patterning the first photoresist layer, applying an etchantto the protection layer 110, the flatness layer 1304, the secondsubstrate 1026, the metallization stack 1016, and/or the ILD layer 1020to selectively etch areas that are not masked by the patterned firstphotoresist layer, and removing the patterned first photoresist layer.The opening 1102 may be formed to have a wider upper portion and anarrower lower portion as shown in FIG. 12. The opening 1102 may also beformed by a sawing process.

As shown in a cross-sectional view 1400 of FIG. 14 and a top view 1500of FIG. 15, a filling layer 1402 is formed in the opening 1102 (see FIG.12). The filling layer 1402 may be a light block material such as ablack resin or other applicable materials. In some embodiments, thefilling layer 1402 may be formed to have a top surface coplanar withthat of the protection layer 110.

As shown in a cross-sectional view 1600 of FIG. 16, the first and secondimage sensor die 1002, 1004 are separated. In some embodiments, theseparation is performed by moving a die saw along the scribe line region1006 (see FIG. 14) through the filling layer 1402 and the firstsubstrate 1012. The separation forms first and second image sensor chips102 a, 102 b correspondingly including the remaining first and secondimage sensor dies and on-wafer light shield structures 104 from theremaining of the filing layer 1402 along the sidewalls of the first andsecond image sensor die. The carrier wafer 1030 (see FIG. 14) is thenremoved.

As shown in a cross-sectional view 1700 of FIG. 17, subsequent to theseparation, the first and second image sensor chips 102 a, 102 b can bepackaged. The image sensor chips can be soldered to a package substrateand/or to an external device by forming a B/EC structure 312 through thefirst substrate 1012. The image sensing chips can also be integrated toa camera module 116. Some examples of such packages and camera modulesare shown and described in FIGS. 1-4 above.

FIG. 18 shows some embodiments of a flow diagram of a method 1800 offorming an integrated circuit device. Although method 1800 is describedin relation to FIGS. 5-17, it will be appreciated that the method 1800is not limited to such structures disclosed in FIGS. 5-17, but insteadmay stand alone independent of the structures disclosed in FIGS. 5-17.Similarly, it will be appreciated that the structures disclosed in FIGS.5-17 are not limited to the method 1800, but instead may stand alone asstructures independent of the method 1800. Also, while disclosed methods(e.g., method 1800) are illustrated and described below as a series ofacts or events, it will be appreciated that the illustrated ordering ofsuch acts or events are not to be interpreted in a limiting sense. Forexample, some acts may occur in different orders and/or concurrentlywith other acts or events apart from those illustrated and/or describedherein. In addition, not all illustrated acts may be required toimplement one or more aspects or embodiments of the description herein.Further, one or more of the acts depicted herein may be carried out inone or more separate acts and/or phases.

At 1802, a first substrate is provided having a plurality of pixelsensing arrays on a front side and a carrier wafer attached to a backside. FIG. 5 shows some embodiments of a cross-sectional view 500corresponding to act 1802.

At 1804, a plurality of color filter arrays is formed over thecorresponding plurality of pixel sensing arrays. FIG. 6 and FIG. 7 showsome embodiments of a cross-sectional view 600 and a top view 700corresponding to act 1804.

At 1806, an on-wafer lens and an on-wafer filtering coating are formedoverlying the color filter arrays. The on-wafer lens has a convex topsurface. FIG. 8 and FIG. 9 show some embodiments of a cross-sectionalview 800 and a top view 900 corresponding to act 1806.

At 1808, a protection layer is formed overlying the plurality of colorfilter arrays. FIG. 10 and FIG. 11 show some embodiments of across-sectional view 1000 and a top view 1100 corresponding to act 1808.

At 1810, a plurality of openings is formed through the protection layerand the first substrate between the color filter arrays. FIG. 12 andFIG. 13 show some embodiments of a cross-sectional view 1200 and a topview 1300 corresponding to act 1810.

At 1812, the openings are filled with a light shield material. FIG. 14and FIG. 15 show some embodiments of a cross-sectional view 1400 and atop view 1500 corresponding to act 1812.

At 1814, a separating process is performed to the light shield materialto form a plurality of discrete dies respectively having an on-wafershield structure spaced around a periphery of the first substrate, thecolor filter array, and the protection layer. At 1816, the carrier waferis removed. FIG. 16 shows some embodiments of a cross-sectional view1600 corresponding to act 1814 and act 1816.

At 1818, a module lens is attached to a front side of the dies, and anelectrical connection structure is formed to a back side of the dies.FIG. 17 shows some embodiments of a cross-sectional view 1700corresponding to act 1818.

It will be appreciated that while reference is made throughout thisdocument to exemplary structures in discussing aspects of methodologiesdescribed herein that those methodologies are not to be limited by thecorresponding structures presented. Rather, the methodologies (andstructures) are to be considered independent of one another and able tostand alone and be practiced without regard to any of the particularaspects depicted in the Figs. Additionally, layers described herein, canbe formed in any suitable manner, such as with spin on, sputtering,growth and/or deposition techniques, etc.

Also, equivalent alterations and/or modifications may occur to thoseskilled in the art based upon a reading and/or understanding of thespecification and annexed drawings. The disclosure herein includes suchmodifications and alterations and is generally not intended to belimited thereby. For example, although the figures provided herein areillustrated and described to have a particular doping type, it will beappreciated that alternative doping types may be utilized as will beappreciated by one of ordinary skill in the art.

Thus, as can be appreciated from above, the present disclosure relatesto a method for forming an image sensor package. An image sensor chip isformed over a package substrate. A protection layer is formed overlyingthe image sensor chip. The protection layer has a planar top surface anda bottom surface lining and contacting structures under the protectionlayer. An opening is formed into the protection layer and spaced arounda periphery of the image sensor chip. A light shielding material isfilled in the opening to form an on-wafer shield structure having asidewall directly contact the protection layer.

In another embodiment, the present disclosure relates a method ofmanufacturing an integrated circuit (IC). The method comprises providinga first substrate having a plurality of pixel sensing arrays formed on afront side and a carrier wafer attached to a back side and forming aplurality of color filter arrays over the corresponding plurality ofpixel sensing arrays. The method further comprises forming a protectionlayer overlying the plurality of color filter arrays. The method furthercomprises forming openings through the protection layer and the firstsubstrate between the filter arrays and filling the openings with alight shield material. The method further comprises performing aseparating process to the light shield material to form a plurality ofdiscrete dies respectively having an on-wafer shield structure spacedaround a periphery of the first substrate, the color filter array, andthe protection layer.

In yet another embodiment, the present disclosure relates to method forforming an image sensor package. A metallization stack is formed over afirst substrate. A device layer having a pixel sensing array is formedover the metallization stack. A color filter array is formed over thepixel sensing array. A micro lens array is formed over the color filterarray. A protection layer is formed overlying the micro lens array. Anopening is formed into the protection layer and spaced around aperiphery of the device layer. The openings are filled with a lightshield material. Then the light shield material is cut through to forman on-wafer shield structure spaced around a periphery of the firstsubstrate, the color filter array, and the protection layer.

The foregoing outlines features of several embodiments so that thoseskilled in the art may better understand the aspects of the presentdisclosure. Those skilled in the art should appreciate that they mayreadily use the present disclosure as a basis for designing or modifyingother processes and structures for carrying out the same purposes and/orachieving the same advantages of the embodiments introduced herein.Those skilled in the art should also realize that such equivalentconstructions do not depart from the spirit and scope of the presentdisclosure, and that they may make various changes, substitutions, andalterations herein without departing from the spirit and scope of thepresent disclosure.

What is claimed is:
 1. A method for forming an image sensor package,comprising: forming an image sensor chip over a package substrate,forming a protection layer overlying the image sensor chip, theprotection layer having a planar top surface and a bottom surface liningand contacting structures under the protection layer; forming an openinginto the protection layer and spaced around a periphery of the imagesensor chip; and filling a light shielding material in the openingforming an on-wafer shield structure having a sidewall directly contactthe protection layer.
 2. The method according to claim 1, wherein theon-wafer shield structure is formed to have a top surface aligned withthat of the protection layer.
 3. The method according to claim 1,further comprising: forming an on-wafer lens having a convex top surfaceand overlying the image sensor chip before forming the protection layer.4. The method according to claim 3, wherein the on-wafer lens is formedwith a sidewall that directly contacts that of the on-wafer shieldstructure.
 5. The method according to claim 3, further comprising:forming an on-wafer filtering coating on the image sensor chip prior toforming the on-wafer lens; wherein the on-wafer filtering coating isconfigured to filter infrared light.
 6. The method according to claim 5,wherein the on-wafer filtering coating is formed with a sidewall thatdirectly contacts that of the on-wafer shield structure.
 7. The methodaccording to claim 1, wherein forming the image sensor chip comprises:forming a first substrate over the package substrate; forming ametallization stack over the first substrate; forming a device layerhaving a pixel sensing array over the metallization stack; forming acolor filter array over the pixel sensing array; and forming a microlens array over the color filter array; wherein the protection layerdirectly contacts the micro lens array.
 8. The method according to claim7, further comprising: forming a flatness layer between the color filterarray and the micro lens array, wherein the flatness layer has asidewall contacting the on-wafer shield structure.
 9. The methodaccording to claim 8, wherein the on-wafer shield structure is formedwith an upper portion wider than or equal to a lower portion.
 10. Themethod according to claim 9, wherein the lower portion contactssidewalls of the first substrate, the metallization stack, and thedevice layer.
 11. The method according to claim 9, wherein the upperportion sits on and has a bottom surface contacting a top surface of theflatness layer.
 12. A method for manufacturing an image sensor package,the method comprising: providing a first substrate having a plurality ofpixel sensing arrays formed on a front side and a carrier wafer attachedto a back side; forming a plurality of color filter arrays over theplurality of pixel sensing arrays; forming a protection layer overlyingthe plurality of color filter arrays; forming openings through theprotection layer and the first substrate between the color filterarrays; filling the openings with a light shield material; andperforming a separating process to the light shield material to form aplurality of dies respectively having an on-wafer shield structurespaced around a periphery of the first substrate, the color filterarray, and the protection layer.
 13. The method according to claim 12,further comprising: removing the carrier wafer from the plurality ofdies; attaching module lens to a front side of the plurality of dies;and forming electrical connection structures to a back side of theplurality of dies.
 14. The method according to claim 12, wherein theopenings are formed respectively including a narrower lower portionwithin the first substrate and a wider upper portion through theprotection layer.
 15. A method for forming an image sensor package,comprising: forming a metallization stack over a first substrate;forming a device layer having a pixel sensing array over themetallization stack; forming a color filter array over the pixel sensingarray; forming a micro lens array over the color filter array; forming aprotection layer overlying the micro lens array; forming an opening intothe protection layer and spaced around a periphery of the device layer;filling the openings with a light shield material; and cutting throughthe light shield material to form an on-wafer shield structure spacedaround a periphery of the first substrate, the color filter array, andthe protection layer.
 16. The method according to claim 15, wherein thelight shield material is formed with a top surface aligned with that ofthe protection layer.
 17. The method according to claim 15, furthercomprising forming an on-wafer lens having a convex top surface and anon-wafer filtering coating configured to filter infrared light on themicro lens array prior to forming the protection layer.
 18. The methodaccording to claim 17, wherein the on-wafer filtering coating is formedwith a sidewall that directly contacts that of the on-wafer shieldstructure.
 19. The method according to claim 17, wherein a bottomsurface of the on-wafer filtering coating, the on-wafer lens, or theprotection layer is formed aligned with a bottom surface of the on-wafershield structure.
 20. The method according to claim 17, wherein an upperportion of the on-wafer shield structure is formed wider than a lowerportion.